New consortium focuses on 3D interconnects

turlif 投稿 "EMC-3D, has been created to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable,

stackable Thru-Silicon-Via (TSV) interconnection process. Many equipment manufacturers, material companies and researchers have joined together to develop processes ".. for creating micro vias between 5 and 30um on thinned 50um 300mm wafers using both via-first and via-last techniques.""